Principal Manufacturing Engineer – Subcon, Backend, Assembly at Jobtailor

職位 Principal Manufacturing Engineer – Subcon, Backend, Assembly
刊登日期 13 Jul 2026
已過期 12 Aug 2026
公司名稱 Jobtailor
地點 香港 | HK
僱傭形式 Full Time

職位描述:

最新職位資訊來自 Jobtailor 職位為 Principal Manufacturing Engineer – Subcon, Backend, Assembly. If the Principal Manufacturing Engineer – Subcon, Backend, Assembly 職位空缺在 香港 符合您的資格,請直接透過更新後的 Jobkos 招聘門戶提交最新的申請或履歷。

請注意,求職申請並非總是容易的,申請人必須符合公司設定的特定要求。我們希望以下在 Jobtailor 職位為 Principal Manufacturing Engineer – Subcon, Backend, Assembly 的職業機會適合您的專業資格。

Responsibilities
  • Act as technical interface between Nexperia and external subcontractor manufacturing sites (assembly / backend production)
  • Review and approve process or material changes introduced by subcontractors (第一頁-level technical gatekeeper)
  • Support process risk assessments and ensure manufacturing changes meet quality and reliability requirements
  • Drive resolution of production issues, yield problems, and quality deviations at subcontractor sites
  • Monitor and manage subcontractor performance, including operational and quality KPIs
  • Support NPI (New Product Introduction) and industrialization of new packages/processes at subcontractors
  • Lead or support cost reduction and value engineering initiatives
  • Participate in audits (customer, quality, VDA) and support compliance verification activities
  • Support project milestones, technical reviews, and subcontractor performance reporting
Requirements
  • Bachelor’s degree in Electrical, Electronics, Mechanical Engineering, or related field
  • 10+ years of experience in semiconductor assembly / wafer level / backend manufacturing
  • Strong experience in high-volume and high-mix production environments
  • Good understanding of semiconductor packaging processes and manufacturing flows
  • Project management experience in engineering or manufacturing environments
  • Strong analytical and problem-solving skills
Certifications & Qualifications
  • Bachelor’s degree in Electrical Engineering
  • Bachelor’s degree in Electronics Engineering
  • Bachelor’s degree in Mechanical Engineering
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工作資料:

  • 公司名稱: Jobtailor
  • 職位: Principal Manufacturing Engineer – Subcon, Backend, Assembly
  • 工作地點: 香港
  • 國家: HK

如何提交申請:

在閱讀並了解職位資料中說明的入職標準及最低資格要求後, Principal Manufacturing Engineer – Subcon, Backend, Assembly at the office 香港 以上,請立即準備好求職信、履歷表(CV)、畢業證書副本及其他證明文件。請透過下方的「下一頁」連結提交申請。

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